PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN, TSOP
• Component height: 0.2-25mm
• Min packing: 0201
• Min distance among BGA: 0.25-2.0mm
• Min BGA size: 0.1-0.63mm
• Min QFP space: 0.35mm
• Min assembly size: (X) 50 * (Y) 30mm
• Max assembly size: (X): 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402, 0201
• High-pin count press fit available
• SMT capacity per day: 800,000 points
 
DIP capability:
• A-8 of semi-assembly work line with 3-set wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process
 
Advantages:
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Microsection, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery