Manufacture capability 

• Layers: 1-16 layers

• Materials: CEM1, CEM3, Teflon, Rogers,FR-4, High Tg FR-4, Aluminum Base, Halogen Free

• Max. Board Size: 510*1200mm

• Material: RoHS Directive-compliant

• PCB thickness: 1.6 ±0.1mm

• Out Layer Copper Thickness: 1-6oz

• Inner Layer Copper Thickness: 1/2oz-5oz

• Max. board Thickness: 6.0mm

• Minimum hole size: 0.20mm

• Minimum line width/space: 3/3mil

• Min. S/M Pitch: 0.1mm(4mil)

• Plate thickness and aperture ratio : 12:1

• Minimum hole copper: 20µm

• Hole dia. Tolerance(PTH):±0.075mm(3mil)

• Hole dia. Tolerance(NPTH):±0.05mm (2mil)

• Hole position deviation:±0.05mm (2mil)

• Outline tolerance:±0.05mm (2mil)

• Surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver

• Solder mask: green

• Legend: white

• Outline: rout and score/V-cut

• E-test: 100%

• Inspection standard: IPC-A-600H/IPC-6012B, Class 2

• Outgoing reports: final inspection, E-test, solderability test, micro section and more

• Certificates: UL (E315391), ISO 14001, TS16949, ISO 9001, SGS